Product Details

LA55-P/SP1 LA55-P In Stock CURRENT HALL 50A AC/DC Closed Loop Bidirectional Module SENSOR

Model Number LA55-P/SP1
Min.Order Quantity 1 pcs
Price Negotiable

Product Features

No.BrandeHZLSbDc
BCM5751FKFB-16 mm125 mm - - - - - -
PIC18F25Q10-I/SP- - 250 mm74.4 mm - 25.4 mm - - -
AN28F010- - - - - 31 mm - - -
WS2812B- - - - - - 240 mm - 105 mm
HTU20- - 36.5 mm - - - - - -
SP6201EM5-L-3-3/TRINA - - - - - - - -
47N60C3-0.34 - - - - - 170 mm -
SPHE8203RINA - - - 125 mm - - - -
MAX30102- - - - - - - - -
SP8266- - 36.5 mm48 mm140 mm14.3 mm - - -
PIC18F26K22-I/SP- - - - - - - 240.0000 mm -
NRF52840-QIAA- - - - 130 mm22.2 mm - - -
SSOP20- - - - - - - - -
SPV1001N30- - - - - - - - -
LM4120AIM5X-2.0- - - - - - - 110 mm -
WTR2605INA - - - 185 mm12 mm - - -
SPW20N60C3- - - - - - - - -
5-14GHz-10 mm - - - 18.2 mm - - -
components)PIC18F252-I/SP- - - - 61 mm12.7 mm - - -
42HB34F08AB- - - - 94 mm - - - -
SPX5205M5-L-5-0/TR-31 mm - - - - - - -
LV25-PINA - - - - - - - -
LA55-P/SP1- - - - 220 mm - - - -

 

Integrated Circuits Chip Electron Components BCM5751FKFB P21T max.:100 °C; Designation of housing:FA205N-; d1:37.4 mm; d:25 mm; G:M6x1; H:125 mm; A:27 mm; N:12mm; A2:39.4 mm; e:16 mm;
New original integrated circuit SPHE8203R SPHE8203S SPHE8203A QFPG:M6x1; C0:11.2 kN; d:30 mm; Weight:1.32 kg; C:19.5 kN; A4:23 mm; L:125 mm; A2:32.2 mm; s1:19.05 mm; Designation of bearing:UC206G2T20;
PIC18F25Q10-I/SP (Supply Electronic Components Chip Microcontrollers Support IC BOM)d:57.15 mm; H:250 mm; J:202 mm; Weight:4.51 kg; s1:32.55 mm; Designation of open end cover:SCOU212-36; S:25.4 mm; Designation of housing:FA212N-; Z:74.4 mm; J1:92 mm;
5-14GHz Psat:41.5dBm GaN Power Amplifiers Bare Die RF Microwave Millimeter wave ComponentsN:12mm; S:18.2 mm; B1:48.3 mm; A2:40.1 mm; C:19.5 kN; Recommended tightening torque for set screw:11.5 Nm; e:10 mm; C0:11.2 kN; T max.:100 °C; H3:80;
SPX5205M5-L-5-0/TR ic chip circuit for led light SOT23B:61.8 mm; Dz:120 mm; e:31 mm; B1:77.7 mm; s1:53.2 mm; Designation of open end cover:SCOE212-60; A:50.4 mm; G:R1/8"; d1:82 mm; A2:77.8 mm;
47N60C3 SPW47N60C3 TO247 BOM List Electronic Components Integrated Circuits MOSFET Transistor 47N60C3B:58 mm; Max operating temperature, Tmax:200 °C; k:5 mm; D1:147.4 mm; rs min:2.1 mm; Static load, C0:522 kN; D:170 mm; e:0.34; Characteristic cage frequency, FTF:0.4 Hz; d2:98.6 mm;
Special Offer Memory Chip Active Electronic Components AN28F010S:31 mm; Recommended tightening torque for set screw:22 Nm; r:2; B:61.9 mm; C1:11.3 mm; B1:79.4 mm; C:36 mm; Weight:2.89 kg; d1:89 mm; T min.:-40 °C;
NEW ORIGINAL integrated circuits PIC16F722-/ML IC Chip with factory pricesDa max:55 mm; Y0:2.28; Mass:0.25 kg; rs min:1.1 mm; Nref:8,800 rpm; Characteristic rolling element frequency, BSF:4.82 Hz; da min:32 mm; Min operating temperature, Tmin:-40 °C; B:17 mm; Associated sleeve reference:H305;
Integrated Circuit Electronic Component IC Chip NRF52840-QIAADesignation of open end cover:SCOU211-32; Designation of bearing:UC211-32G2L3; T min.:-20 °C; L:130 mm; G:M6x1; S:22.2 mm; B:55.6 mm; C0:29.2 kN; C:43.55 kN; s1:27.8 mm;
Integrated Circuits Chip LM4120AIM5X-2.0 SOT-23Fatigue limit load, Cu:12.4 kN; d:60 mm; D:110 mm; Min operating temperature, Tmin:-20 °C; d1:77.5 mm; ra max:1.5 mm; Da max:102 mm; r1s min:1.5 mm; r1a max:1.5 mm; Characteristic inner ring frequency, BPFI:9.3 Hz;
Effect MOS transistor SPW20N60S5N:19mm; Designation of bearing:UC305-15G2L3; T max.:100 °C; S:15 mm; e:16 mm; Recommended tightening torque for set screw:3.7 Nm; A1:13 mm; L:80 mm; Designation of housing:FL305-; C:22.36 kN;
SP6201EM5-L-3-3/TR original Integrated circuit SOT23-5 SP6201EM5 SP6201EM5-L-3-3A4:23 mm; H3:80; Designation of bearing:EX206G2T20; N:12mm; d:30 mm; J:100 mm; T min.:-20 °C; Designation of housing:FC206N-; G:M6x1; C:19.5 kN;
Mobilephone RF Chip WTR2605 New OriginalRecommended tightening torque for set screw:22 Nm; d:55 mm; H3:125; S:12 mm; B:32.5 mm; L:185 mm; T max.:100 °C; Weight:3.67 kg; s1:36.95 mm; N:19mm;
SSOP20 2.8V-5.5V Support DAC/PWM Plug-in SPI-FLASH Voice IC Chip WT588D WT588D-20SST:25 mm; r1a max:2.5 mm; Y2:1.31; Y0:0.72; Min operating temperature, Tmin:-40 °C; d1:96 mm; Max operating temperature, Tmax:120 °C; ra max:3 mm; Dynamic load, C:94.5 kN; Characteristic inner ring frequency, BPFI:13.12 Hz;
Original New Current Transducer module stock modules LV25-P LA55-P/SP7 LA55-PA:25.5 mm; C:9.55 kN; A1:11 mm; d:15 mm; G:M6x1; d1:27.2 mm; Weight:0.43 kg; Recommended tightening torque for set screw:5.5 Nm; B:19.1 mm; T max.:100 °C;
PIC18F26K22-I/SP PIC18F26K22-E/SP PIC18F26K22 DIP-28 High-Performance MicrocontrollersBasic Dynamic Radial Load Rating C:203000 N; B:50.00 mm; Grease Speed Rating Open/Shielded n1:2600 rpm; Oil Speed Rating n2:3200 rpm; D:240.0000 mm; Basic Static Radial Load Rating Co:180000 N; Grease Speed Rating n1:2600 rpm; Fillet Radius ra:2.50 mm; d:110.000 mm; Sealed Speed Rating n3:1800 rpm;

 

 

LA55-P/SP1 LA55-P In Stock CURRENT HALL 50A AC/DC Closed Loop Bidirectional Module SENSOR Video

 

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